OPTION

Real-time temperature monitoring instantly reflects measurement results.

The newly developed temperature sensor measures V-I curves to detect semiconductor failures and misassembled components that conventional in-circuit testing cannot. It also offers temperature compensation and non-contact measurement to prevent temperature drift, further improving test coverage.
*Applicable to 2400, 2600 Series only

Automatically removes foreign substances such as flux, improving measurement stability.

The system includes a probe cleaner that automatically removes flux and dust from the flying probe tips, with adjustable cleaning interval. This reduces false judgments and ensures stable, reliable inspections.
*Applicable to 2400, 2600 Series only

Creates shadows, making contours clearer.

By illuminating the object from an angled direction, shadows are created by surface irregularities, making it easier to capture the contours of the object.
Effective for reading laser-engraved 1D and 2D codes.
Lateral illumination can be mounted on axis of 1, 4, 5, and 6.
*Applicable to 2400, 2600 Series only

Electrical detection of IC lead solder failure in BGA, QFP, SOJ, etc.

The sensor probe is placed over the IC package and reads the signals emitted from inside the IC to make numerical determinations.
This allows lead solder failure in BGA, QFP, SOJ, etc. to be electrically detected without damaging the IC unit.

Automatic and numerical determination of mounted LED test

The LEDs on the circuit board are illuminated and the emitted color is detected using a dedicated color sensor. It quantifies the hue, saturation, and brightness of the emitted color, normally difficult to distinguish visually, enabling stable test with clear criteria. There is no need to prepare a dedicated jig.

Combined test of in-circuit test + laser displacement measurement

Measures the height between the circuit board surface and the component upper surface in a non-contact manner by optical measurement using laser light, and reliably detects mounting defects such as component float, which cannot be detected by in-circuit testing.
It also has a function of detecting the amount of circuit board warpage and automatically correcting the probe contact position to prevent contact errors.

APT-1400F series: Optional
APT-1600FD series: Standard

Expansion of defect detection area

Two vertical probes are added to the standard four tilted probes to accurately contact points in the gaps between components and points that have been previously inaccessible, such as vias, through-holes, and upward connectors, thus enhancing defect detection ability.
Several types of probes with different tip shapes are available so that the optimal contact method can be selected according to the shape of the test target.
In addition, the dual Z-axis option that automatically switches between two different types of vertical probes according to the test program eliminates the need for manual probe replacement, allowing for more efficient test.

Conveyor transfer is ideal for ICT test of mass-production circuit boards

Supports inline test that incorporates a flying probe tester into the production line for efficient mass production.
Fully automated test by connecting with the SMT line and with the loader/unloader/flipper contributing to reducing the burden on operators and saving labor cost.
When used with a 3D-AOI (Visual inspection machine), defects that cannot be detected by image inspection itself, such as micro-bridges, can be reliably detected electrically. This eliminates false information, improving test capability and increases speed.

Combination test of ICT and BST

In-circuit testing using a flying probe tester excels at testing the electrical characteristics of mounted electronic components in analog circuits. However, components that cannot be contacted are difficult to test electrically, and dofunctional tests of digital circuits. In such cases, the boundary scan test can perform in a short time for interconnection test between LSI pins and on-board programming to FPGAs, etc., but it can only test digital circuits around ICs that conform to the boundary scan standard and a dedicated jig may be required for the connection.

Instead of using a jig for connecting between the 4-5 scanning pins and a device required for the boundary scan test, Takaya flying probe tester have an own technology to testwithout using any additional jigs. This allows you to perform the boundary scan test by making the flying probe function as a virtual boundary scan cell, even if ICs complied with BST or non-complied ICs and connectors are mixed.

This technology makes test more efficient than ever before, allowing simultaneous test of both digital and analog circuits with a flying probe tester.

Connection to external equipment via multi-probe on a dedicated jig

This is an option to install a dedicated jig lifting mechanism on the bottom side of the APT-1600FD series.
It allows special test that connect to external equipment such as BST (JTAG boundary scan test), and the In System Programing/log reading of FPGAs and other ICs to be performed in parallel with in-circuit test.

Data exchange across equipment types, OS, manufacturers

OPC UA (OPC Unified Architecture) is an open international standard established for secure and reliable data exchange in industries.
After the OPC foundation announced it in 2008, it was internationally standardized under IEC62541. It is recommended as a standard communication for Industry 4.0 and is spreading around the world. Takaya offers an option to install an OPC UA server to the APT series of flying probe testers. We are working to promote the industrial IoT standard to bridge factory automation equipment and IT.